As AI chip power rises, the cold plate contacts the heat source directly — the core of cold-plate liquid cooling. ASPER cold plates use 316L stainless vacuum-brazed channels, low flow resistance, uniform temperature and helium leak <=1e-9 Pa·m³/s, supplied as a set with our manifolds for Huawei ten-thousand-GPU clusters.
| Material | 316L stainless (clean brazing) |
|---|---|
| Process | vacuum-brazed one-piece channel |
| Flow | balanced branches, uniform die temp |
| Leak | helium <=1e-9 Pa·m³/s |
| Interface | quick-connect / flange, mainstream compatible |
| Match | supplied with liquid-cooling manifold |
one-piece channel, no joint leaks
branch resistance balanced, low die delta-T
polished inner bore, no particle shedding
plate + manifold delivered together
Contacts the chip to draw heat into coolant — the cold-plate cooling end unit.
Cold-plate is cheaper to retrofit and fits air-cooled racks; immersion cools more but needs bigger retrofit.
Coolant cleanliness and long-term corrosion resistance.
Per-piece helium test, <=1e-9 Pa·m³/s.
Plate is the end unit; manifold distributes coolant — set supply is more stable.
With ASPER manifolds, supplied to Huawei ten-thousand-GPU clusters.
图纸深化 → 打样确认 → 批量交付 → 现场验收，全程有兜底
24 小时内出具三表联动报价单（参数设置表 + 综合单价分析表 + 工程量清单）
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